Toshiba Memory America Adds BiCS FLASH to Lineup of e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products

SAN JOSE, Calif.–(BUSINESS WIRE)–Toshiba
Memory America, Inc.
(TMA), the U.S.-based subsidiary of Toshiba
Memory Corporation, today announced that it will begin sampling new
JEDEC e-MMC[1] Ver. 5.1[2] compliant embedded
flash memory products for consumer applications next month. The new
products integrate the company’s BiCS FLASH™ 3D flash memory and a
controller in a single package.


The company will continue to reinforce its market-leading position by
delivering a broad, high-performance product lineup, including for
applications that continue to need e-MMC as an embedded memory solution.

“e-MMC remains an important solution for many applications,” noted Scott
Beekman, director of managed flash memory products for Toshiba Memory
America, Inc. “Our e-MMC products with BiCS FLASH 3D flash memory will
enable these applications to continue to have access to the latest flash
technology.”

Key Specifications

Interface    

JEDEC e-MMC V5.1 standard
HS-MMC interface

Density[3]     16GB, 32GB, 64GB, 128GB
Power Supply Voltage     2.7V to 3.6V (Memory core)
1.7V to 1.95V (Interface)
Bus Width     ×1 / ×4 / ×8
Temperature Range     -25℃ to +85℃
Package     153Ball FBGA
11.5mm × 13.0mm
   

New Product Lineup

Product Name

    Capacity[3]     Package     Mass Production
THGAMRG7T13BAIL     16GB     11.5×13.0×0.8mm     3Q, 2019 (Jul.-Sep.)
THGAMRG8T13BAIL     32GB     11.5×13.0×0.8mm     3Q, 2019 (Jul.-Sep.)
THGAMRG9T23BAIL     64GB     11.5×13.0×0.8mm     3Q, 2019 (Jul.-Sep.)
THGAMRT0T43BAIR     128GB     11.5×13.0×1.0mm     3Q, 2019 (Jul.-Sep.)
           

For more information, please visit business.toshiba-memory.com.

Notes:

[1]   Embedded MultiMediaCard. e-MMC is a product category for a class of
embedded memory products built to the JEDEC e-MMC Standard
specification and is a trademark of the JEDEC Solid State Technology
Association. The new product supports the command queuing and secure
write protection functions which is specified as an option in JEDEC
Ver. 5.1
[2] One of standard specifications of embedded flash memory defined by
JEDEC.
[3] Toshiba Memory Corporation defines a gigabyte (GB) as 1,000,000,000
bytes. Product density is identified based on the density of memory
chip(s) within the Product, not the amount of memory capacity
available for data storage by the end user. Consumer-usable capacity
will be less due to overhead data areas, formatting, bad blocks, and
other constraints, and may also vary based on the host device and
application. For details, please refer to applicable product
specifications.
 

About Toshiba Memory America, Inc.

Toshiba Memory America, Inc. is the U.S.-based subsidiary of Toshiba
Memory Corporation
, a leading worldwide supplier of flash
memory
and solid
state drives (SSDs)
. From the invention of flash memory to today’s
breakthrough 96-layer BiCS FLASH™ 3D technology, Toshiba continues to
lead innovation and move the industry forward. For more information on
Toshiba Memory, please visit business.toshiba-memory.com.

© 2019 Toshiba Memory America, Inc. All rights reserved. Information in
this press release, including product pricing and specifications,
content of services, and contact information is current and believed to
be accurate on the date of the announcement, but is subject to change
without prior notice. Technical and application information contained
here is subject to the most recent applicable Toshiba product
specifications.

Contacts

MEDIA CONTACT:
Justine Houston-Brown
Lages & Associates
Tel.:
(949) 453-8080
[email protected]

COMPANY CONTACT:
Rebecca Bueno
Toshiba Memory America,
Inc.
Tel.: (949) 737-7321
[email protected]

error: Content is protected !!