AI Hardware Summit: launches in Beijing, following sell out in USA

SAN FRANCISCO & BEIJING–(BUSINESS WIRE)–lt;a href=”https://twitter.com/hashtag/AI?src=hash” target=”_blank”gt;#AIlt;/agt;–The AI
Hardware Asia Summit, June 4
th – 5th
in Beijing
is the second in a global series focusing on AI
accelerator technologies and the design and application of silicon and
systems for processing deep learning, neural networks and computer
vision.

Worldwide, there are over 100 different hardware accelerators in
development for processing machine learning workloads, in both server
and client computing environments. Estimates for global market
opportunity for AI chips vary between USD 43 billion and USD 91 billion
by 2025. In 2018, Intel Corporation claimed data center AI chip revenues
of over USD 1 billion, while AI chip start-ups collectively have raised
in excess of USD 2.5 billion in funding since 2017. Over thirty
companies developing AI processors are based in the APAC region
.

“Two overarching efforts are indispensable in this AI chip
development frenzy: objectively evaluating and comparing different chips
(benchmarking), and reliably projecting the growth paths of AI chips
(road mapping).”
White Paper on AI Chip Technologies: Tsing Hua
University & Beijing Innovation Center for Future Chips, December 2018.

The AI
Hardware Asia Summit
, aims to introduce the US and Chinese
markets to help build a clear roadmap of the global AI chip industry and
assess emerging technologies for processing machine learning in the data
center and at the Edge.

Presenting Chinese companies include Alibaba, Baidu and Horizon
Robotics, while international representatives include Graphcore, Groq,
SambaNova Systems and Flex Logix. The event has a high contingent of
C-level attendees and is intended for a strategic, decision-making
audience.

The agenda includes presentations from:

  • Lingjie Xu, Alibaba Inc. on The Long March of AI Chips: Challenges and
    Opportunities
  • Dr Kai Yu, Horizon Robotics on China’s First Commercial AI Vision
    Processor: A Full-Stack Solution for AI
  • Zhang Li, Canaan Creative on Applications of Canaan Creative’s
    Kendryte K210 AI Chip
  • Thomas Andersen, Synopsys on Enabling the Path to Device Intelligence
  • Yi Shan, DeePhi (Xilinx) on FPGA-based AI platform, technology,
    application, and ecosystem’
  • Cheng Wang, Flex Logix on A Modular, Scalable Edge Inference
    Architecture for 1 to >100 TOPS with Very Low DRAM Bandwidth
  • Ouyang Jian, Baidu on Baidu Kunlun: Making Computing More Intelligent
  • Embedding AI in Everything: Reconfigurable
  • Shouyi Yin, Tsing Hua University on Architecture for Energy Efficient
    Neural Network Processing
  • Kunle Olukotun, SambaNova Systems on Designing Computer Systems for
    Software 2.0

All speakers will be available to meet with potential customers,
partners and industry peers.

To download the full agenda visit www.aihardwaresummit.com.

Kisaco Research produces, designs and hosts B2B industry conferences,
exhibitions and communities – focused on a specialized selection of
topic areas.

Contacts

Press contact for AI Hardware Asia Summit:
Stephanie Wright
Marketing
Director, Kisaco Research
[email protected]
+44
(0)203 897 6804

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