Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs

Collaboration enables customers to utilize Cadence RF solutions to design 5G, IoT and automotive applications on UMC’s 28nm process technology

SAN JOSE, Calif. & HSINCHU, Taiwan–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) and United Microelectronics Corporation (UMC), a global semiconductor foundry, today announced that the Cadence^® millimeter wave (mmWave) reference flow has achieved certification for UMC’s 28HPC+ process technology. With this certification, mutual Cadence and UMC customers have access to an integrated RF design flow that accelerates time to market. The complete mmWave reference flow, based on UMC’s Foundry Design Kit (FDK), includes an actual demonstration circuit with a highly automated circuit design, layout, signoff and verification flow that provides more seamless design in 28HPC+.

The certified mmWave reference flow supports the Cadence Intelligent System Design™ strategy, which enables customers to achieve SoC design excellence. To learn more about the Cadence RF solutions that support the UMC 28HPC+ process technology, visit www.cadence.com/go/CadenceRFSolutions.

High-frequency mmWave RF designs require accurate electromagnetic (EM) extraction and simulation analysis in addition to analog and mixed-signal capabilities. The mmWave reference flow, based on the Cadence Virtuoso^® RF solution, brings together the industry-leading schematic capture, layout implementation, parasitic extraction, EM analysis and RF circuit simulation, along with integrated layout versus schematic (LVS) and design rule checking (DRC) in a single flow. This flow also incorporates EM analysis using the Cadence EMX^® Planar 3D Simulator and Cadence AWR^® AXIEM^® 3D Planar EM Analysis into the trusted Virtuoso and Spectre^® platforms, providing a high level of automation and the ability to analyze performance of RF circuits pre- and post-silicon.

The certified mmWave reference flow includes:

Design capture and simulation via the Virtuoso Schematic Editor, Virtuoso ADE Explorer and Assembler, Spectre X Simulator, Spectre AMS Designer and the Spectre RF Option
Layout implementation via the Virtuoso Layout Suite and Physical Verification System (PVS)
Parasitic extraction of transistor-level interconnects via the Quantus™ Extraction Solution
Electromagnetic analysis of interconnects across transistors including passive RF structures via the EMX or AWR AXIEM 3D Planar simulators

“Through our collaboration with UMC, our mutual customers can now take advantage of the most advanced features within the industry-leading Virtuoso and Spectre platforms while leveraging our EMX and AWR AXIEM integrated EM solvers for designing 5G, IoT and automotive applications,” said KT Moore, vice president, product management in the Custom IC & PCB Group at Cadence. “This flow allows engineers using the UMC 28HPC+ process technology to more accurately predict circuit performance in silicon, which is critical for meeting productivity and time-to-market goals.”

With its AEC Q100 automotive grade-1 platform solution, UMC’s production-proven 28HPC+ solution is able to serve a complete range of applications, from digital to mmWave. 28HPC+ utilizes a high-performance High-k/Metal Gate stack, and UMC further extends its SPICE model coverage to 110GHz for mmWave in order to serve mobile phone, automotive/industrial radar and 5G FWA/CPE applications. Customers can leverage UMC’s mmWave FDK to design a transceiver IC, or integrate the foundry’s well-established digital and analog IP to accelerate their mmWave SoC design.

“We’ve developed a comprehensive mmWave reference flow with Cadence that utilizes their comprehensive RF design flow in conjunction with a UMC foundry kit so engineers can create accurate, innovative designs using our 28HPC+ process technology,” said T.H. Lin, director of IP Development and Design Support at UMC. “Leveraging the flow capabilities and the familiar Virtuoso design environment, customers can minimize iterations and deliver designs based on our 28nm technology much more efficiently.”

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications including consumer, hyperscale computing, 5G communications, automotive, aerospace, industrial and health. For six years in a row, Fortune Magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry. The company provides high quality IC production with a focus on both logic and specialty technologies to serve every major sector of the electronics industry. UMC’s comprehensive technology and manufacturing solutions include logic/RF, embedded high voltage, embedded flash, RFSOI/BCD and IATF-16949 automotive manufacturing certification for all its manufacturing facilities. UMC operates 12 fabs that are strategically located throughout Asia with a maximum capacity of more than 750,000 8-inch equivalent wafers per month. The company employs approximately 19,000 people worldwide, with offices in Taiwan, China, United States, Europe, Japan, Korea and Singapore. For more information, please visit: http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

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