KIOXIA Puts Next-Gen SSDs, Future-Ready Form Factors in the Spotlight at CES
SAN JOSE, Calif.–(BUSINESS WIRE)–#KumoScale–This week at CES® 2023, KIOXIA America, Inc., the inventors of NAND flash, will highlight new technologies, products, and form factors designed to meet upcoming IT requirements and standards – including PCIe® 5.0 and UFS 4.0.
In an ever-changing technology landscape, where evolving standards push performance levels higher and higher, KIOXIA stands ready for what comes next – thanks to its broad, diverse lineup of flash storage solutions. “Whether it’s the next connected vehicle, the next personal mobility device or the next smart city – we keep advancing flash memory to make the next thing possible,” said Alex Mei, vice president of corporate marketing for KIOXIA America, Inc. “Countless consumer devices and applications require flash memory and SSDs, and we are committed to continued innovation.”
KIOXIA CES exhibits can be accessed by visiting the company’s exhibit room (Zeno 4710) on Level 4 of the Venetian® Meeting Center from January 5-7 and include:
- Scalable BiCS FLASH™ 3D flash memory technology solutions – including XL-FLASH™ and 4-bit per cell quad-level-cell (QLC) technology
- Flash memory solutions for automotive, consumer and industrial applications – including SLC NAND, UFS 4.0 and XFMEXPRESS™
- Broad lineup of KIOXIA SSDs – representing the latest standards, technologies, and form factors
- KIOXIA client SSDs – including XG8 and BG5 Series NVMe™ SSDs
For more information, please visit www.kioxia.com.
About KIOXIA America, Inc.
KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people’s lives and expand society’s horizons. The company’s innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive, and data centers. For more information, please visit KIOXIA.com.
© 2023 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications.
Notes:
CES is a registered trademark of the Consumer Technology Association
The NVMe word mark is a registered or unregistered trademark or service mark of NVM Express, Inc. in the United States and other countries. Unauthorized use strictly prohibited.
PCIe is a registered trademark of PCI-SIG.
All other company names, product names and service names may be trademarks of their respective companies.
Contacts
MEDIA CONTACT:
Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
dena@lages.com
COMPANY CONTACT:
Mia Cool
KIOXIA America, Inc.
Tel.: (408) 526-3087
mia.cool@kioxia.com