Bond Launches Credit Card as a Service Using i2c’s Global Platform
Leading payment processor and banking-as-a-service provider enable credit access through personalized credit solutions
REDWOOD CITY, Calif.–(BUSINESS WIRE)–i2c Inc., a leading provider of digital payment and banking technology, today announced its partnership with Bond Financial Technologies Inc., the leading embedded finance platform, to offer easier credit access to Americans through the Credit Builder Card and Bond Credit.
According to Experian, nearly one-third of U.S. consumers have a subprime credit score, and 49 million U.S. consumers are presently classified as either “credit invisible” or “unscorable.” Powered by i2c’s agile SaaS platform, Bond Credit Builder Card allows businesses to offer a secured credit building program for their customers in a matter of weeks, not months, with approved customers being able to use their card wherever Mastercard or Visa are accepted. With consistent on-time payments, Bond-secured Credit Builder Card users will be able to increase their credit scores over time.
i2c also processes payments for the Bond Credit solution, in which customers leverage Bond’s easy-to-use APIs and Sandbox to create personalized credit products that can help their users manage expenses, scale business, offer rewards, and tailor repayment schedules. If approved, customers have immediate access to a virtual credit card.
“We are proud to partner with Bond as they work to reimagine credit in new and innovative ways utilizing banking-as-a-service and embedded finance,” said Ava Kelly, Chief Product Officer of i2c Inc. “With our highly-configurable platform, Bond gains the ability to self-service programs for their clients, to easily and rapidly launch a wide-range of use cases.”
“Bond was built to give brands and banks the ability to scale safely so that they can provide exceptional customer experiences to all,” said Roy Ng, Co-founder and CEO of Bond. “With our credit products being backed by i2c’s agile processing platform, companies can now launch credit programs with Bond quickly and seamlessly.”
About Bond
Bond enables any company to become a fintech. Through Bond’s full-stack embedded finance platform, customers can offer personalized and compliant financial products to their end users, with a focus on high value-add products such as consumer and commercial charge cards. Bond was founded in 2019 by industry veterans from Blackrock, Goldman Sachs, SAP, SoFi, and Twilio, with deep roots in financial services, technology and enterprise software. Bond is a remote-first company, with office locations in San Francisco (HQ), New York City and Salt Lake City. Visit http://www.bond.tech to learn more.
About i2c Inc.
i2c is a global provider of highly-configurable payment and banking solutions. Using i2c’s proprietary “building block” technology, clients can easily create and manage a comprehensive set of solutions for credit, debit, prepaid, lending and more, quickly and cost-effectively. i2c delivers unparalleled flexibility, agility, security and reliability from a single global SaaS platform. Founded in 2001, and headquartered in Silicon Valley, i2c’s next-generation technology supports millions of users in more than 200 countries/territories and across all time zones. For more information, visit www.i2cinc.com and follow us at @i2cinc.
Contacts
Media Contacts:
Ava Kelly, Chief Product Officer, i2c Inc. media@i2cinc.com
Jill Reed, Sift Communications: bond@siftpr.com